Prime Minister Anwar says Malaysia will build large-scale chip design park

kuala lumpur – Malaysian leaders announced plans on April 22 to build a massive semiconductor design park, aimed at boosting the country’s role in the global chip industry.

Malaysia has been a prominent player in the semiconductor industry for decades, accounting for an estimated 13% of global back-end manufacturing, according to German tech giant Bosch.

Prime Minister Anwar Ibrahim said on April 22 that the country wants to move beyond production and emerge as a chip design powerhouse as well.

In his speech, he referred to British chip design and said: “We are delighted to announce Southeast Asia’s largest IC (integrated circuit) design park, which will house world-class anchor tenants and collaborate with global companies such as Arm. ” he said. Giant.

He said the park would be located in Selangor, but did not provide details on cost or schedule.

AFP has contacted Arm for comment.

This project will be an important step for Malaysia. Malaysia has long been a center for semiconductor manufacturing, with many facilities located on the northern island of Penang, often referred to as the country’s Silicon Valley.

In recent years, tensions between the United States and China over advanced technology, particularly semiconductors, have forced many companies to consider moving manufacturing from China to other countries such as Malaysia, Vietnam and India.

The Malaysian government is actively investing in the semiconductor industry and Datuk Seri Anwar said the country should have taken better advantage of past opportunities to grow the sector.

“The fact is we’ve missed opportunities in technology investment, so it’s imperative that we reimagine our strategy,” he said on April 22.

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